2008 Electrical Design Of Advanced Packaging And Systems Symposium Edaps. Challenges in the Design of Next Generation of Mixed Signal Packages. Cadence Design Systems Jian Liu is currently the Sr.
Systems Symposium EDAPS 2008. The IEEE Electrical Design of Advanced Packaging and Systems EDAPS Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip package and systems for electronics applications. The IEEE Electrical Design of Advanced Packaging and Systems EDAPS symposium a flagship event in the Asia-Pacific region has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip package and system.
He was the Co-Chair of the 2007 IEEE Electrical Design of Advanced Packaging and Systems EDAPS Workshop the General Chair of the 2015 AsiaPacific EMC Symposium APEMC and the Technical Program Chair of the 2010 and 2012 IEEE EDAPS Symposiums.
IEEE Transactions on Circuits and Systems II TCASII 2014 current Public Relations Secretary. Hong Kong China 2008 Electrical Design of Advanced Packaging and Systems Symposium Location. Was Co-Chair of the 2007 IEEE Electrical Design of Advanced Packaging and Systems EDAPS workshop Chair of the 2008 International workshop on EMC and Technical Program Chair of. Roy is a member of the Technical Program Committee for the IEEE Electrical Performance of Electronic Packaging and Integrated Systems Conference and the IEEE Workshop on Signal and Power Integrity.